Teardown and BoM Analysis for Xiaomi Pocophone F1

POCO F1 is the first phone from POCO, Xiaomi’s sub-brand. Xiaomi decided to release a mid-to-high end model to take on increasing competition from OnePlus.

Although POCO F1 is designed and built from scratch it does use Xiaomi’s R&D and expertise in several areas.

This teardown aims to give an idea of components on the inside and the related cost.

  • Xiaomi Poco F1 is the cheapest Snapdragon 845 device on the market, making it a great proposition for affordable flagship users.
  • The specs offered are still top notch for the price point. This will also help Xiaomi to raise the overall ASP.
  • Xiaomi knowing the local market dynamics has saved on SoC cost as well by opting out features like Cat 20 LTE capabilities and choosing only the relevant LTE band support. Instead, the Snapdragon 845 on the Poco F1 comes with LTE-A Cat 16 support.
  • Xiaomi has been able to keep the cost down by choosing a simple design and economical construction material such as a polycarbonate back panel and an unspecified version of the Gorilla glass.
  • Further, Xiaomi has cleverly opted for the Qualcomm Quick Charge 3.0 instead of the latest 4.0 and excluded Optical Image Stabilization (OIS), NFC, an IP rating, headphones to keep the Bill of Material (BoM) cost down.
  • By keeping the design simple, Xiaomi might have saved on complex R&D and manufacturing costs as well, passing on the savings to the consumer.
  • Xiaomi is also using an application-based advertisement model to earn revenue from the device.


For complete teardown analysis, download the report here.

For complete BoM cost analysis, download the report here.