BoM Analysis for Asus Zenfone 8 Flip

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Oct 11, 2021

Overview:

The report is an extended analysis of the Bill of Materials covering the components that constitute Zenfone 8 flip. This will help in understanding the cost structure and the Components used in the Smartphone with the iconic flip camera mechanism.

Table of Contents: 

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Category

Industry

Semiconductors

Report Type

Report

Summary

Published

Oct 11, 2021

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Author

Ethan Qi

Ethan is an associate director in Counterpoint's Greater China team, dedicated to research of smart device, semicondutor and BoM analysis, and emerging technologies. Ethan has been working in the handset and semiconductor industry for 10+ years. Prior to joining Counterpoint Research, Ethan served Coolpad, VIA and Intel sequentially as senior technology researcher and product manager respectively.