Intel E810-XXVDA2 Teardown Analysis

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Mar 27, 2025

Overview: The report is a teardown analysis of the Intel E810-XXVDA2 Network Adapter. This will help in understanding the key function layout, key components’ markings, power delivery chain, and thermal solution analysis.

In addition, readers can get the BoM cost distribution by the function of this device.

Table of Contents:

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Category

Industry

Semiconductors

Report Type

Report

Time period

Other

Summary

Published

Mar 27, 2025

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Author

Shenghao Bai

Shenghao Bai is a senior analyst at Counterpoint Research, specializing in Teardown & BoM analysis and smartphone supply chain research. He is also a certified Project Management Professional (PMP). Shenghao has extensive experience working with leading smartphone and smart device companies, including Samsung Electronics, OPPO, and Xiaomi, where he oversaw hardware development and project management across a range of products. His expertise spans product planning and emerging technology trends.