Overview: The report is a teardown analysis of the Intel E810-XXVDA2 Network Adapter. This will help in understanding the key function layout, key components’ markings, power delivery chain, and thermal solution analysis.
In addition, readers can get the BoM cost distribution by the function of this device.
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Shenghao Bai
Shenghao Bai is a senior analyst at Counterpoint Research, specializing in Teardown & BoM analysis and smartphone supply chain research. He is also a certified Project Management Professional (PMP). Shenghao has extensive experience working with leading smartphone and smart device companies, including Samsung Electronics, OPPO, and Xiaomi, where he oversaw hardware development and project management across a range of products. His expertise spans product planning and emerging technology trends.
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