Overview: This report presents a chip-level teardown analysis of Intel’s EYE810-XXVAM2 Ethernet controller, which powers the E810-XXVDA2 SmartNIC. It is intended for semiconductor professionals, analysts, and engineers seeking insights into the SoC’s internal structure, manufacturing process, and packaging. The report includes optical and X-ray imaging, metal layer and contact analyses, and estimates of the fabrication node. Its purpose is to support competitive benchmarking, technology evaluation, and strategic planning.
Table of Contents:
l Intel E810-XXVDA2 Ethernet Adapter Key Specifications
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Category
Industry
Semiconductors
Report Type
Report
Time period
Other
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Author
Brady Wang
Brady Wang has over 20 years of experience working in high-technology companies, ranging from semiconductor manufacturing to market intelligence and strategic advisory roles. Currently, at Counterpoint, Brady specializes in semiconductors, with a focus on cutting-edge applications such as automotive and advanced process nodes.
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