Memory Solutions for Gen AI Part 16: Advanced Packaging Part 2, Memory's New Battleground
Overview:
As AI reshapes data infrastructure, the importance of advanced packaging—offering faster data processing and transmission with lower power consumption—has rapidly expanded beyond the data center. Once confined to GPUs paired with HBM, the spotlight now shifts to edge computing. Even conventional DRAM is no longer immune to the changes. Despite the industry’s oligopolistic structure, fierce competition lies ahead.
Table of Contents:
- The Edge Gets Edgy.
- DRAM Goes Vertical.
- China Raises the Stakes.
Number of Pages: 4
Published Date: August 2025
Category
Industry
AI, Semiconductors
Service
Memory
Report Type
Report
Time Period
Other
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Author
MS Hwang
MS Hwang is a research director at Counterpoint, specializing in memory semiconductor research. MS Hwang brings over 30 years of experience from Samsung Electronics and sell-side brokerage research roles including ABN AMRO, Goldman Sachs, Credit Suisse and Samsung Securities.