Memory Solutions for Gen AI Part 14: Advanced packaging with HBM

1
Jul 1, 2025

Overview:

The growing proliferation of AI data centers has fueled demands for faster data processing and transmission, as well as greater energy efficiency and cooling, prompting us to rethink how we configure processing units and memory through advanced packaging.

Table of Contents:

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Category

Industry

AI , Semiconductors

Report Type

Report

Time period

Other

Summary

Published

Jul 1, 2025

Contact us

Author

MS Hwang

MS Hwang is a research director at Counterpoint, specializing in memory semiconductor research. MS Hwang brings over 30 years of experience from Samsung Electronics and sell-side brokerage research roles including ABN AMRO, Goldman Sachs, Credit Suisse and Samsung Securities.