Overview:
The report provides a comprehensive analysis of the semiconductor industry's wafer capacity distribution across different process nodes. The report examines the quarterly capacity for both advanced and matured nodes, highlighting the shifts and trends that are reshaping the foundry landscape. It offers insights into the technological capabilities and strategic plans of key players, with a particular focus on TSMC's collaboration with ASML in implementing EUV (Extreme Ultraviolet) lithography.
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Brady Wang
Brady Wang has over 20 years of experience working in high-technology companies, ranging from semiconductor manufacturing to market intelligence and strategic advisory roles. Currently, at Counterpoint, Brady specializes in semiconductors, with a focus on cutting-edge applications such as automotive and advanced process nodes.
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