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Report

Global Smartphone AP Shipment Forecast (Full Year), Q1 2023 - Q4 2025E

1
March 20, 2025

Overview: This report tracks the smartphone AP/SoC Shipment forecast for full-year 2025E. We cover historical data starting from Q1 2023 to Q4 2024. This report also includes full-year chipset shipment forecast by chipset vendors (like Qualcomm, MediaTek, Apple, UNISOC, Google, Samsung, Huawei and JLQ) and by quarters for full-year 2025E. This report will help you to understand the smartphone chipset shipment market trends in 2025.

  • Summary:
    • After two years of significant declines, the smartphone semiconductor market is likely to turn the corner, with 2024 smartphone AP-SoC shipments rebounding 17% YoY.
    • In 2025, we expect the market to grow by low-single digits. The premium segment continues to grow.
    • 5/4nm is going to be another long-term node; transition from the 6/7nm node, particularly in entry-level 5G chipsets.
    • TSMC remains untouchable at advance nodes; SMIC will gain some share due to Huawei, however, capacity expansion remains challenging due to the current geopolitical situation

Table of Contents:

  • Global Smartphone AP/SoC Shipment Full Year forecast by Chipset vendors Q1 2023-Q4 2025E

Published Date: March 2025

Category

Industry

Semiconductors

Service

Smartphone SoC

Report Type

Report

Time Period

Quarterly

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Author

Parv Sharma

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Parv is a Senior Analyst with Counterpoint Technology Market Research based out of Gurgaon, India. He has over 10 years of experience at Counterpoint in market research and strategic consulting across the global technology and telecom sectors. He tracks the global semiconductor ecosystem, with a focus on HPC and data center compute, server CPUs, and AI infrastructure — covering competitive dynamics across Intel, AMD, Arm, Nvidia, and hyperscaler custom silicon. His research also spans the smartphone semiconductor ecosystem — including the Application Processor (AP)/SoC market, foundry, node and manufacturing technology, the RFFE ecosystem and value chain, and smartphone Bill of Materials (BoM) analysis — as well as the Automotive and Connected Car value chain. He leads a team driving data analysis and insights and contributes regularly to media coverage on semiconductors and AI infrastructure.