Overview: The report is an analysis of the Bill of Materials covering the components that constitute the Samsung Galaxy Z Flip6. This will help in understanding the cost of each function, the costs of key components, and the product’s cost structure.
Table of Contents:
- Function-level cost analysis
- Component-level cost analysis
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Author
Shenghao Bai
Shenghao Bai is a senior analyst at Counterpoint Research, specializing in Teardown & BoM analysis and smartphone supply chain research. He is also a certified Project Management Professional (PMP). Shenghao has extensive experience working with leading smartphone and smart device companies, including Samsung Electronics, OPPO, and Xiaomi, where he oversaw hardware development and project management across a range of products. His expertise spans product planning and emerging technology trends.
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