The NAND flash consumption of mobile devices will be three times larger in 2025 than 2021, with the coming of the 5G era
- Better performance in sequential reading/writing speed and bandwidth
- Larger capacity to 256GB, 512GB, and above
- Lower costs including 3D NAND, TLC, QLC
- Better controller qualities in architecture, lifetime, wear leveling, over-provisioning
- Embedded Storage Interfaces including UFS 2.1, UFS 3.x, UFS4.x, and PCIe
- Better reliability to improve the lifetime of the device
Opportunity for storage players
eMMC 5.1 can still meet the demand for some devices migrating initially from 4G to 5G. However, The UFS interface aligns best with most 5G devices because of its high Gbps-level throughputs. Connected PCs will need both UFS storage and PCIe SSDs, while others will prefer UFS as the main storage interface.
From the perspective of the package, MCP solutions are dominant only in the low to mid-range smartphones. While system designers for high-performance mobile devices prefer to use package-on-package (PoP) solution which includes low power DRAM plus discrete UFS or eMMC. PoP solutions can provide better performance than MCP solutions because the application processor (AP) can directly communicate with low power DRAM at high frequencies to reduce the interference of AP and RAM communication signals.
From the perspective of performance, eMMC has become the mainstream of mobile application data storage for several years. However, the speed of eMMC is reaching a limit because of its parallel 8-bit transmission. As a result, UFS is poised to become the mainstream interface in the 5G era because its serial interface and full-duplex data transfer protocol can offer two to four times the peak bandwidth of eMMC’s parallel 8-bit interface. UFS 2.x and UFS 3.x can reach a maximum speed of 11.6Gbps (1450 MB/s) and 23.2Gbps (2,900 MB/s), respectively. Both are much higher than eMMC 5.1's 3.2Gbps (400 MB/s). Future UFS 4.x can be even faster.
The UFS interface aligns well with the higher Gbps level throughputs promised in 5G, compared to eMMC which could be a bottleneck for some 5G-driven mobile devices such as connected PCs, XR devices, smartphones, and tablets. Further, the power consumption of UFS in standby mode is like that of eMMC. In the active mode, UFS power consumption is higher than eMMC but UFS can rapidly transmit more data, allowing a return to an idle state faster. So, UFS is significantly lower compared to eMMC in terms of overall power consumption and can enable battery savings for battery-powered IoT applications. Further, UFS also delivers greater overall system performance and user experiences, which makes it the choice of memory storage interface for 5G mobile devices.
Compared to 5G's 1-10 Gbps, the theoretical transmission rate of 4G LTE can exceed 1Gbps, but the actual speeds in most cases are still below 500Mbps. 5G-powered XR, online game, and 8K video will require speeds of 6 Gbps, so UFS is essential in these applications.
Conclusion & Recommendations
- UFS is the most suitable interface for 5G-driven mobile devices. Its fast speed and responsiveness can meet the requirements of instant-on, fast-booting, multitasking, and multiprocessing in the 5G era. Also, it consumes less power so it can extend battery life.
- Mobile game streaming will grow strongly with 5G's large bandwidth and low latency. Content providers need to know the capability, requirements, and limitations of 5G and design high-quality mobile games with cloud streaming on any device.
- The price of NAND flash is declining. However, 5G-centric devices will require high-performance storage solutions. Mobile devices manufacturers must understand the characteristics of different types of flash to choose the appropriate memory to meet the performance requirements of their applications.
- To be successful in the 5G era, flash makers must understand the demand and the impact of these 5G devices on storage and realize the market potential for various applications to provide the right solutions
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Author
Brady Wang
Hi, I’m Brady Wang, a seasoned professional with over 20 years of experience in the high-tech industry, spanning semiconductor manufacturing, market intelligence, and strategic advisory roles. Currently, I serve as an analyst at Counterpoint Research, where I specialize in semiconductors with a focus on advanced applications such as automotive, server platforms, and cutting-edge process nodes. My core research centers on AI servers and their key components, including GPUs, custom accelerators, high-bandwidth memory (HBM), CPUs, and advanced packaging technologies. I also track the evolution of AI server architectures, interconnect technologies, and data center deployment trends. By combining deep technical knowledge with market insight, I help clients navigate the fast-changing AI infrastructure landscape and make strategic, data-driven decisions.